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Silicon Micromachining Techniques

Petersen fellow ieee invited paper bulk silicon etching techniques used to selectively remove silicon from substrates have been broadly applied in the. While both wet and dry etching techniques are available to both bulk and surface micromachining bulk micromachining typically uses wet etching techniques while surface micromachining primarily uses dry etching techniques.

The Black Silicon Method V A Study Of The Fabricating Of

Fabricating Mems And Nanotechnology

Micromachining

Micromachining semiconductor processing microelectronic fabrication semiconductor fabrication mems fabrication and integrated circuit technology are terms used instead of microfabrication but microfabrication is the broad general term.

Silicon micromachining techniques. Generally polysilicon is used as one of the substrate layers while. Application of silicon micromachining techniques for the manufacturing of new passive thz components stephan biber jan schur lorenz peter schmidt. Any micromachining technique removes a part of a bulk substrate or of a thin film using various etching methods. Surface micromachining builds microstructures by deposition and etching structural layers over a substrate. This is different from bulk micromachining in which a silicon substrate wafer is selectively etched to produce structures. With epi micromachining new issues must be addressed and these are discussed below. Silicon grown either as a monocrystal or as a polycrystal is the familiar material for micromachining performed in this case with standard techniques for silicon processing. Micromachining is related to specific techniques applied to micro and meso scale elements in order to produce components with high precision and very restrictive dimensional and geometrical tolerances micron or sub micron. Bulk micromachining selectively etches the silicon substrate to create microstructures on mems devices. Processing techniques micromachining techniques require a sacrificial etch step which can be achieved using both dry and wet etching. Bulk micromachining of silicon gregory t. Kovacs member ieee nadim i. In this section the processing for each technique is described sepa rately. Structures fabricated using these new technologies may have lateral dimensions similar to those of surface micromachining but with a considerably increased vertical dimension. Maluf member ieee and kurt e.

In this paper the development of these silicon micmmachining techniques is discussed along with the compatibility issues. Like surface micromachining bulk micromachining can be performed with wet or dry etches although the most common etch in silicon is the anisotropic wet etch. Bulk micromachining starts with a silicon wafer or other substrates which is selectively etched using photolithography to transfer a pattern from a mask to the surface.