Besides metals a wide range of other materials can be cut with laser including semiconductors plastics organic materials ceramics paper graphite diamonds as well as composite materials. Non metallic cutting with a pulsed fiber laser from spi lasers although more typically used for marking nanosecond pulsed fiber lasers are ideally suited to cut a surprising range of materials.
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Fiber laser cutting ceramics. Higher power lasers can be used to reduce process time without compromising edge quality due to the materials high thermal conductivity. Alone the absorption characteristics of the laser beam in ceramics have allowed this technology to dominate this market segment for so long. Laser cutting of other materials broad application spectrum. With smaller diameter of focusing spot it has fine marking effect and mainly used to mark engrave and cut for special materials for the high end market. Scribes shown in fig. 3d uv laser marking machine features. Laser engraving of ceramics is achieved using a co 2 laser. 2 are compared alongside those cut using the new fiber laser assisted process. Perfect lasers 3d uv laser marking machine uses high quality ultraviolet laser source. Laser processing of ceramics is typically performed using a 106 or 93 micron co 2 laser with some ceramics also absorbing a 106 micron fiber laser wavelength. The holes are roughly 000075 in. 3d uv laser marking machine introduction. Using a fiber laser also allows aln ceramic to be cut in its green state before the material is fired. They are low cost. Laser cutting of thin film ceramic is also possible using a co 2 laser producing a clean edge with little discoloration.
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