Any micromachining technique removes a part of a bulk substrate or of a thin film using various etching methods. Bulk silicon etching techniques used to selectively remove silicon from substrates have been broadly applied in the fabrication of micromachined sensors actuators and structures.
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Silicon grown either as a monocrystal or as a polycrystal is the familiar material for micromachining performed in this case with standard techniques for silicon processing.
Micromachining of silicon. Semiconductor micromachining is the main technology for mems implementation. Petersen fellow ieee invited paper bulk silicon etching techniques used to selectively remove silicon from substrates have been broadly applied in the. Surface micromachining builds microstructures by deposition and etching structural layers over a substrate. Bulk silicon etching techniques used to selectively remove silicon from substrates have been broadly applied in the fabrication of micromachined sensors actuators and structures. Like surface micromachining bulk micromachining can be performed with wet or dry etches although the most common etch in silicon is the anisotropic wet etch. This is different from bulk micromachining in which a silicon substrate wafer is selectively etched to produce structures. Maluf member ieee and kurt e. Bulk micromachining of silicon gregory t. Generally polysilicon is used as one of the substrate layers while. Kovacs member ieee nadim i. Despite the more recent emergence of higher resolution surface micromachining approaches the majority of currently shipping silicon sensors are made using bulk. Bulk micromachining starts with a silicon wafer or other substrates which is selectively etched using photolithography to transfer a pattern from a mask to the surface. Despite the more recent emergence of higher resolution surface micromachining approaches the majority of currently shipping silicon sensors are made using bulk etching.
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